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  • Antique Copper Laminates HPL (Art Series)

Antique Copper Laminates HPL (Art Series)

 

Antique Copper Laminates HPL is an HPL cladding product group that uses real copper on the surface and is patterned with artist-designed motifs. The copper panels are processed with natural finishing methods, bringing out the tonal transitions and surface character of copper. The series carries fine ornamental details and dynamic forms developed by international artists onto architectural surfaces.

Key Advantages

  • Real copper surface
  • Pattern options developed with artist motifs
  • Copper tone and texture effect created through natural finishing processes
  • Ability to apply a copper look to walls, furniture, and architectural surfaces in HPL format

Motifs and Surface Structure

The Antique Copper series consists of motifs featuring fine ornamental details and fluid, dynamic form transitions. The motifs are designed to work in harmony with the natural surface response of copper. This structure provides depth on the surface, a clear motif language, and a strong visual flow.

Applications

  • Wall and column cladding
  • Reception desks and back-wall surfaces behind counters
  • Furniture surfaces (doors, panels, decorative surfaces)
  • Retail interiors and display units
  • Hotel, restaurant, and café interior applications
  • Showrooms and exhibition stands

Technical Specifications (Fields for the Page)

  • Product type: HPL with real copper surface
  • Surface: Motif-patterned / natural finishing effect
  • Application: Bonding onto substrates such as MDF, particleboard, plywood, etc.
  • Use: Interior applications

Processing and Application Notes

  1. Balancing (Backer) Layer
    For metal/copper-surfaced laminates, an equivalent balancing laminate/backer on the reverse side is required for panel stability.
  2. Press Temperature
    Press temperature should be controlled. Excessive heat with metal-surfaced laminates may negatively affect surface character.
  3. Adhesive Selection and Cleanliness
    Do not use adhesives contaminated with dust/particles. Foreign particles may cause point defects on the surface.
  4. Press Surface
    Press plates must be clean and even. Potential sources of surface marking should be eliminated.
  5. Protection and Contact
    Cleaning and protection routines for copper surfaces should be planned according to the application area and intensity of use.





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