Dekodur Inox HPL (Real Stainless Steel Surface Laminate)
Dekodur Inox HPL is a metal HPL laminate that uses real
stainless steel (inox) on the surface. It brings the clean, technical, clear
look of stainless steel into an HPL format suitable for wall, furniture, and
architectural surfaces. It is used in interior projects by bonding onto
substrates such as MDF, particleboard, and plywood.
Key Advantages
- Real
stainless steel (inox) surface
- Ability
to apply a stainless-steel look to large surfaces in HPL format
- Suitable
structure for wall/column cladding, counters, and furniture surfaces
- Compatibility
with production processes by bonding onto common substrates (MDF,
particleboard, plywood)
- A
panel-based approach to stainless-steel appearance in architectural
detailing
Applications
- Wall
and column cladding
- Counters,
reception areas, and service desks
- Retail
interiors, showcases, and display units
- Hotel,
restaurant, and café interior applications
- Elevator
cabin interior surfaces and entrance lobbies
- Laboratory,
clinic, and technical-area furniture (project-dependent)
- Showrooms
and exhibition stands
Technical Specifications (Fields for the Page)
- Product
type: Metal HPL with real stainless steel surface
- Surface:
Inox / stainless steel appearance
- Application:
Bonding onto substrates such as MDF, particleboard, plywood, etc.
- Use:
Interior applications
Processing and Application Notes
- Balancing
(Backer) Layer
For metal-surfaced laminates, an equivalent balancing laminate/backer on the reverse side is required for panel stability. - Press
Temperature
Temperature must be controlled when pressing metal laminates. Press temperature should not exceed 50°C; whenever possible, work at lower temperatures. - Adhesive
Selection and Cleanliness
Recommended adhesive types: PVA and fast contact adhesives. Do not use adhesives contaminated with dust/particles; if unavoidable, filter/sieve before application. - Press
Surface
Press plates must be clean and even. Potential sources of surface marking should be eliminated. - Pressure
Keep applied pressure low. Process parameters should be set according to the substrate and panel dimensions.



